Technology

Welcome into your
future standards

ICON Photonics has developed a monolithic on-chip layer, structured in 3D with a customizable shape.

Using standard cleanroom processes, this technology revolutionizes the optical coupling and packaging of many fields and applications.

One technology
Multiple advantages

  • Full optical coupling even with the world smallest optical apertures (from 30um to 1 um)
  • Applicable to every component you need (VCSEL, PD…)
  • Working with every kind of optical fibers (SMF, MMF, MCF…)
  • Increasing the optical misalignment tolerances
  • High tolerance to vibrations and temperature : TELCORDIA standards passed
  • Applicable on wafers, arrays or singulated chips

On the right, you can visualize the added-value of our standard solution to your optoelectronic component :

  • Increase of the coupling efficiency pick → reduction of the losses
  • Increase of the alignment tolerances → our taper shape increases the effective area of your component

One technology
Multiple advantages

  • Full optical coupling even with the world smallest optical apertures (from 30um to 1 um)
  • Applicable to every component you need (VCSEL, PD…)
  • Working with every kind of optical fibers (SMF, MMF, MCF…)
  • Increasing the optical misalignment tolerances
  • High tolerance to vibrations and temperature : TELCORDIA standards passed
  • Applicable on wafers, arrays or singulated chips

You can visualize below the added-value of our standard solution to your optoelectronic component :

  • Increase of the coupling efficiency pick → reduction of the losses
  • Increase of the alignment tolerances → our taper shape increases the effective area of your component

What can we do for you ?

What can we do for you ?

One technology
infinity of solutions

Our expertise & knowledge in the electro-optical and MEMS fields give us the possibility to work on many specific projects, on a wide range of applications :

  • Hermetic solutions for glue / index liquid
  • Wirebonding / Flip-chip compatible
  • Multi-Core Fiber (MCF) applications
  • Cryogenic compatibility

We can also propose advanced packaging solutions

  • 90° angle-tolerant solutions available
  • With or without bonded-Si fixture, such as fiber holders
  • Your specific packaging needs !

We design our technology and adapt our offers to your requirements
Come have a look to some of our different markets :

One cleanroom
many possibilities

ICON Photonics can provide a wide variety of cleanroom services to suit your needs !

From backend to frontend process, ICON Photonics can provide the service you need. A few examples of our capabilities :

DRIE 3″ or 4″ or 6″, Dicing, Sputtering, Photolithography, Optical and mechanical profilometry, SEM characterization

As well as standard or custom reliability tests :

Temperature Cycling, Moisture, Shear stress, etc…