Welcome in your future photonics packaging standards
Integrated packaging platform
All-in-one package: Combination of functionalities using scalable Wafer-Level Microfabrication techniques
From pluggable to co-packaged Optics. Excellent precision by semiconductor processing techniques enabling low loss coupling and easy assembly process steps for ultra-high speed modules.
Easy customization applicable with multiple applications:
optical interconnects, quantum photonics and sensing over a wide range of wavelength (0.5 to 5µm)
Full Wafer-Level microfabrication : cost-effective mass production solution
TELCORDIA standards passed / Cryogenic validation down to 4mK / Reflow process validation above 300°C / Mechanical stability and robustness