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Welcome in your future photonics packaging standards
![test-color](https://icon-photonics.com/wp-content/uploads/2019/10/test-color.png)
Welcome in your future photonics packaging standards
Integrated packaging platform
All-in-one package: Combination of functionalities using scalable Wafer-Level Microfabrication techniques
![Wafer](https://icon-photonics.com/wp-content/uploads/2022/06/Picture2-7.png)
All-in-one package: Combination of functionalities using scalable Wafer-Level Microfabrication techniques
![Wafer](https://icon-photonics.com/wp-content/uploads/2022/06/Picture2-7.png)
Your benefits
![Logo_Fast](https://icon-photonics.com/wp-content/uploads/2022/07/d16f008.png)
MINIATURIZATION
From pluggable to co-packaged Optics. Excellent precision by semiconductor processing techniques enabling low loss coupling and easy assembly process steps for ultra-high speed modules.
![Logo_Versatility](https://icon-photonics.com/wp-content/uploads/2022/07/d16f009.png)
VERSATILITY
Easy customization applicable with multiple applications:
optical interconnects, quantum photonics and sensing over a wide range of wavelength (0.5 to 5µm)
![graphique-de-croissance](https://icon-photonics.com/wp-content/uploads/2022/08/graphique-de-croissance.png)
SCALABILITY
Full Wafer-Level microfabrication : cost-effective mass production solution
![Icon_Reliability](https://icon-photonics.com/wp-content/uploads/2022/08/Pictures2.png)
RELIABILITY
TELCORDIA standards passed / Cryogenic validation down to 4mK / Reflow process validation above 300°C / Mechanical stability and robustness