Technology

Our main innovations

Light coupling technology

Proprietary breaking through optical coupling technology at wafer-level using a 3D polymer microoptics to enable low losses interface (down to 0.1dB) at very low size optical aperture & optical mode. Relax alignment tolerances (up to ±30µm at 1dB losses). Compatible for SMF, MMF and MCF / PIC, VCSEL, PD and more.

Passive fiber
holder fixtures

Mechanical fixture to provide
self-alignment assembly from single fiber to N–fiber–arrays. Capability of high-volume industrialization is provided by our in-house wafer-level manufacturing processes.

Si electrical interposer

Si interposer gathers OE/EO, optical and electronics components on one chip to integrate your sub-assembly. Our advanced eWLP interconnects offers millimiter-waves performances. All these solutions are compatible with standard processes such as wire-bonding or flip-chip techniques.

Adapted to your challenges

Surface packaging

Out-of-the-plane fiber to chip coupling and packaging, either from / to a detector, a VCSEL, a grating coupler (GC)… both at chip or wafer-level.

Edge packaging

Edge coupling and packaging topology with the need to inject or collect light from the chip edge, either from / to a PIC, DFB laser, waveguides….

Advanced

The technology versatility combined with strong Microwave & Photonics expertise at your disposal to tackle advanced coupling and micro-packaging challenges

One technology. Infinity of solutions.

One technology. Multiple advantages.

Our 3 main innovations

Light coupling expertise

Breaking through optical coupling technology using a 3D polymer microoptics to enable low losses interface (down to 0.1dB) as well as relax alignment tolerances (up to ±30µm at 1dB losses).

Passive fiber fixtures

Mechanics fixture to provide self-alignment assembly from single fiber to Nx fiber arrays. Capability of high-volume industrialization is provided by our in-house wafer-level manufacturing processes.

Si electrical interposer

Si electrical interposer embedding the active device integrating DC and RF Electrode enabling ultra fast chip interconnections. All these solutions are compatible with standard processes such as wire-bonding or flip-chip techniques.

Adapted to your situation

Edge Packaging

Edge coupling and packaging topology with the need to inject or collect light from the chip edge, either from / to a DFB laser, waveguides….

Surface packaging

Out-of-the-plane fiber to chip coupling and packaging, either from / to a detector, a VCSEL, a grating coupler (GC)… both at a chip-level or at a wafer-level.

Others

The technology versatility combined with strong Microwave & Photonics expertise at your disposal to tackle advanced coupling and micro-packaging challenges

MINIATURIZATION

From pluggable to co-packaged Optics. Excellent precision by semiconductor processing techniques enabling low loss coupling and easy assembly process steps for ultra-high speed modules.

VERSATILITY

Easy customization applicable with multiple application: optical interconnects, quantum photonics, sensing over a wide range of wavelength (0.5µm to 5µm).

SCALABILITY

Full Wafer-Level microfabrication : cost-effective mass production solution.

RELIABILITY

TELCORDIA standards passed / Cryogenic validation down to 4mK / Reflow process validation up to 350°C / Mechanical stability and robustness.