ICON Photonics proposes innovative high performance optical coupling and packaging solutions for very high speed optical communications.
An optical packaging technology with multiple technical and industrial advantages:
- Smaller-size higher-speed chip optical coupling and packaging
- Applicable with VCSELs and Photodiodes, to single-mode and multi-mode optical fibers
- High tolerance to optical misalignment, vibrations and temperature
- Compatible with passive alignment and assembly equipment
- Chip, array and wafer level compatibility and integrability
- Applications to datacom (DC, AOC, etc.) and telecom up to 400Gbps