On-chip micro-optics
Integrate optics directly into your chips to experience the best coupling efficiency!
We deposit our patented micro-structures at the chip or wafer-level, customized for your specific needs, reducing the coupling losses to near zero.
Key added-values
0.1dB
(min.) Very low-losses
10mK – 350°C
Cryo to reflow compatible
Markets & usecases
Photodiodes, VCSELs, Grating couplers...
Surface coupling
You want to bring fibers directly to your chips ? We can take care of it ! With fiber holder structures deposition (chip or wafer-level) we will be able to deliver your chips already packaged with fiber arrays right in place.
All that taking advantage of our patented coupling structures of course !
Key added-values
0.1dB
(min.) Very low-losses
10mK – 350°C
Cryo to reflow compatible
Markets & usecases
Photodiodes, VCSELs, Grating couplers (PIC), Single-photon detectors & sources...
Edge coupling
When it comes to edge coupling, we will customize and manufacture Fiber-Array-Units with our patented Spot-Size-Converter (FAU-SSC) in order then to align them and fix them on your chip facet.
A high volume manufacturing while keeping very low losses !
Key added-values
1dB
(min.) Very low-losses
10mK – 350°C
Cryo to reflow compatible
Markets & usecases
PIC facets, edge-emitting lasers...
Advanced solutions
Freespace coupling
Our patented spot-size converters can be used as beam-shapers, directly integrated at your chip output.
Useful for highly dense LEDs or VCSELs.
90° light-turn solutions
Switching from vertical to edge, or vice versa, is a keypoint for numerous applications.
We are actively working to provide 90° light-turn solutions, such as fiber bending but also integrated photonics ones.
Detachability
You will soon be able to get the best coupling efficiency and the best compacity available in a simple plug-and-play solution.
Revolutionizing several usecases such as CPO (Co-Packaged Optics).
Our facilities
Our offices since the very beginning of our story in 2017 ! A well-living zone to have everything we need to provide you the best solutions.
ISO4 zone equipped with high-end equipments to do optical elements characterization, measurements, but also fiber packaging for small and medium volumes.
Heart of our technical solutions, we work with a ISO5 cleanroom equipped with the best equipments to handle and work on your chips and wafers, from 2'' to 6'' size.